TeRAM develops custom 3D SRAM memory and packaging technologies for frontier AI deployments, integrating high-bandwidth, low-power memory directly onto AI compute chips
TeRAM develops custom 3D SRAM memory and packaging technologies for frontier AI deployments, integrating high-bandwidth, low-power memory directly onto AI compute chips. It is initially targeting data centers, with designs tailored to customer capacity, bandwidth, form-factor, and power requirements, and also aims to serve edge devices.