Co-led Syenta's $26M Series A with Australia's National Reconstruction Fund for advanced semiconductor packaging.
Syenta is architecting the future of AI computing through its revolutionary Localized Electrochemical Manufacturing (LEM) technology, which enables High-Resolution Interconnects - a new class of chip-to-chip connections that transcends traditional packaging to deliver wafer-level system integration at unprecedented density
Syenta is architecting the future of AI computing through its revolutionary Localized Electrochemical Manufacturing (LEM) technology, which enables High-Resolution Interconnects - a new class of chip-to-chip connections that transcends traditional packaging to deliver wafer-level system integration at unprecedented density.