Co-led FusionAP's $2M pre-seed round to build a Malaysia-based advanced semiconductor packaging (OSAT) platform.
FusionAP is a Malaysia-based advanced semiconductor packaging company delivering next-generation 2
FusionAP is a Malaysia-based advanced semiconductor packaging company delivering next-generation 2.5D, 3D, and beyond-Moore solutions by combining chiplet architectures, advanced interconnects, and system-level optimisation into scalable, manufacturable designs.