Portfolio company JSSI Semi completed a RMB 600 million financing round for high-end semiconductor packaging and testing.
JSSI Semi is engaged in the research, development, and commercialization of integrated circuit packaging and testing solutions
JSSI Semi is engaged in the research, development, and commercialization of integrated circuit packaging and testing solutions. Its products include quad-flat no-leads, wafer level chip scale package, ball grid array, land grid array, system in a package, package on a package, and 2.5D/3D packaging formats.