A semiconductor packaging and test manufacturing solutions provider specializing in Chiplet and high-end chip packaging design, simulation, scaled manufacturing, and finished-product testing
A semiconductor packaging and test manufacturing solutions provider specializing in Chiplet and high-end chip packaging design, simulation, scaled manufacturing, and finished-product testing. Its capabilities include advanced packaging processes such as 2.5D, SiP, FCBGA, wafer bumping, wafer probing, and final testing, serving research institutions and commercial customers.